Search results for: bonding fixture

OF DOCUMENT BEING CONTINUED: CONTINUED ON NEXT PAGE PAGE 5 OF 23 PAGES SPE4A5-22-T-207B SECTION B PR: 0094798393 NSN/MATERIAL:4920012291150 ITEM DESCRIPTION BONDING FIXTURE BONDING FIXTURE RA001: THIS DOCUMENT INCORPORATES TECHNICAL AND/OR QUALITY REQUIREMENTS (IDENTIFIED BY AN 'R' OR AN 'I' NUMBER) SET FORTH IN FULL TEXT IN THE DLA MASTER LIST OF TECHNICAL AND QUALITY REQUIREMENTS FOUND ON THE WEB AT:

No Description Provided Contact Information: JESSICA ROBINSON-WILER804-279-4592JESSICA.ROBINSON-WILER@DLA.MIL Office Address :DLA AVIATIONASC COMMODITIES DIVISION8000 JEFFERSON DAVIS HIGHWAYRICHMOND VA 23297USA Location: DLA Aviation - BSM Set Aside: Award Number: SPE4A619P6887 Award Amount : $33950.00 Award Date: 0118190001 Awardee: Arrowhead Global LLC 22033 US19 N Clearwater 33765-2362 US

THE FOLLOWING ITEMS WILL BE INCLUDED IN THIS SOLICITATION: HAND CRANK ADAPTER PART NUMBER: B7901806 QTY: 41 EA BONDING FIXTURE PART NUMBER: B7901610 QTY: 41 EA ADAPTER RING PART NUMBER: B7901610 QTY: 41 EA PROSPECTIVE VENDORS MUST BE CERTIFIED UNDER THE UNITED STATES/CANADA JOINT CERTIFICATION PROGRAM (JCP) (HTTPS://WWW.DLIS.DLA.MIL/JCP/) TO BE GRANTED ACCESS TO THE TECHNICAL DATA (TDP) FOR THIS SOLICITATION, VIA FBO (WWW.FBO.GOV).

Caul Plate Bonding Fixture, P/N 06150-09014-042T018-QTY 1Manipulator, P/N 06001-05000-011T046-QTY 1Sponson Sling, P/N 06800-06001-041T097-QTY 1Sponson Install Tool, P/N 06800-06000-011T046-QTY 1SPONSON TO CABIN ALIGNMENT TOOL, P/N 06800-06000-011T046.02-QTY 1MASTER CYLINDER TEST/HOLDING FIXTURE, P/N 06265-01800-101HF-QTY 1Sponson Cart, P/N 06800-06000-011T010-QTY 1METERING PIN INSTALLATION/REMOVAL TOOL, P/N 06265-01800-101MP-QTY 1Fuselage Holding

Lighting fixtures. Grounding and bonding in conformance with applicable codes. Duct banks and manholes. Raceways and installation components and all required supports. Excavation and backfill (excavation in rock shall be included). Cutting and core drilling associated with electrical work.

Any fixtures or substrate-holding required to interface with our bonding system shall be included and work seamlessly with the existing bonding system and the alignment system. The bond alignment system shall be capable of handling wafers from 3” up to 200mm diameter.Additionally, the mask aligner shall be capable of standard contact alignment modes that include, soft-contact, hard-contact, vacuum-contact, and proximity mode.

OF DOCUMENT BEING CONTINUED: CONTINUED ON NEXT PAGE PAGE 6 OF 23 PAGES SPE4A5-23-T-363Q SECTION B PR: 7003288974 NSN/MATERIAL:4920012502704 ITEM DESCRIPTION ALIGNMENT FIXTURE ALIGNMENT FIXTURE .