Type : Bid Notification
Direct Metal Laser Melting Alloy 188
Direct Metal Laser Melting Alloy 188
It has been determined that GE Additive is the sole provider of Direct Metal Laser Melting (DMLM) Alloy 718 Single Piece Heat Exchanger.NASA/NSSC will be the procuring center for this effort.
The solicitation will be issued for a Firm Fixed-Price (FFP) to ensure the contractor shall provide and install one (1) laser powder bed fusion (L-PBF) Additive Manufacturing systems (M2 – Series 5 Direct Metal Laser Melting (DMLM) and associated equipment for US Army at Aviation and Missile Center (AvMC), Redstone Arsenal, AL.
The requirements for the delivery and certification of one (1) Direct Metal Laser Melting (DMLM) additive manufacturing systems that are compatible with the technology transfer, material data, and component design. This solicitation will be solicited as an unrestricted acquisition and result in a Firm Fixed-Price (FFP) contract without options. The Period of Performance is 24 months (730 days) after the date of contract modification, FOB Origin.
The requirements for the delivery, installation, and certification of one (1) Direct Metal Laser Melting (DMLM) additive manufacturing systems that are compatible with the technology transfer, material data, and component design. This solicitation will be solicited as an unrestricted acquisition and result in a Firm Fixed-price contract without options.
The requirements for the delivery, installation, and certification of two (2) Direct Metal Laser Melting (DMLM) additive manufacturing systems that are compatible with the technology transfer, material data, and component design. This solicitation will be solicited as an unrestricted acquisition and result in a Firm Fixed-price contract without options. The Period of Performance is 365 days after the date of contract modification, FOB Origin.
The requirements for the delivery, installation, and certification of one (1) Direct Metal Laser Melting (DMLM) additive manufacturing systems that are compatible with the technology transfer, material data, and component design that are compatible with the technology transfer, material data, and component design.