Search results for: optoelectronic device bonding facility

Refine your Search
Apply several filters to get precise search results
Showing opportunity 1 - 1 of 1
  • Optoelectronic Device Bonding Facility

    Type : Bid Notification

    Due : 27 Mar, 2023 (13 months ago)
    Posted : 14 months ago
    Started : 02 Mar, 2023 (14 months ago)

    DESCRIPTION OF PROCUREMENTThe University is conducting an RFP for Optoelectronic Device Bonding Facility The University seeks to acquire a fully automated, computer-controlled, automated photonic device assembly system and software control to provide additional experimental capabilities complimentary to that of the existing laser systems. The procurement is anticipated to involve negotiation. An electronic auction is not anticipated.

    From: MerX (Federal)