Type : Bid Notification
TEM 12 will build upon previous TEMs with increased technical discussion, operational feedback, targeted prototyping contract opportunities, and strategic government/industry sessions.
TEM 12 will build upon previous TEMs with increased technical discussion, operational feedback, targeted prototyping contract opportunities, and strategic government/industry sessions.
FULL-SERVICE AGREEMENT ON TEM TECNAI MICROSCOPE Solicitation ID/Procurement Identifier: 75N93024P00483 Ultimate Completion Date: Mon Mar 31 17:00:00 GMT 2025
This TEM will help describe the future operating environment and technical challenges, while providing participants a better understanding of ASD(MC)’s efforts, vision, threats, technical priorities, capability challenges, and areas that need private sector support.
The JCM TEM 7 Community is an area set up to contain information in support of the TEM 7 Event happening on 2 December 2021 in Nashville, TN. It is NOT the site to register for the actual TEM 7 Event. Everyone needing access to the JCM TEM 7 Community will need to request an account regardless of any prior JCM TEM access.
Industrial Research||IIP-Dehradun - CSIR||Purchase-IIP - CSIRTender Reference NumberIIP/PUR/2/1516/JEOLTender ID 2024_CSIR_190158_1Withdrawal AllowedYesTender TypeSingleForm Of ContractSupplyTender CategoryGoodsNo. of Covers1General Technical Evaluation Allowed NoItemWise Technical Evaluation AllowedNoPayment ModeNot ApplicableIs Multi Currency Allowed For BOQNoIs Multi Currency Allowed For FeeNoAllow Two Stage BiddingNo -- TitleSpare parts of JEOL TEM
To provide all labor, materials, parts, and equipment for the installation of the new Pro Tem Paintbooth for Building 137 per Performance Work Statement Specification # 01-24-4940 dated 12/08/2023. Build out of additional breaker cabinet from existing materials – No ChargeService Contract Labor Standards 15-4143 REV. 26 applies and is incorporated.Contracting Officer Representative (COR): Justin Rowe
infrared (O-PTIR) microscope. 6: High brightness compact X-ray or EUV sources for semiconductor metrology 7: Nanoscale dimensional metrology reference standards to support semiconductor metrology 8: Advanced Electron Backscatter Diffraction (EBSD) detector offering high pixel density, high-speed and low noise operation, and low kV detection enabled by directly detecting electrons using an application specific integrated circuit (ASIC) detector 9: TEM