Grounding and Bonding Training Course

1. The purpose of this acquisition is for the DISA PAC identified subject matter expert (SME) to provide 18 CS personnel with training on proper grounding and bonding techniques for telecommunications equipment per Institute of Electrical and Electronics Engineers (IEEE) industry standards. The scope of work includes an instructor lead, in-person, hands-on, comprehensive training course covering Institute of Electrical and Electronics Engineers (IEEE) industry standard grounding and bonding course.2. Basis for Award: The award will be made to the offeror who has met the technical acceptability of the accreditation/accreditation and the course outline on the basis of the lowest quotation price.3. Offerors must be registered in the System for Award Management (SAM) at http://www.sam.gov/, to be considered for award. A current copy of a prospective awardee’s Reps and Certs will be validated using the SAM website prior to the issuance of an award. Failure to comply with SAM registration will deem the offeror ineligible for award.4. Note: Funds are not presently available for this effort. No award will be made under this solicitation until funds are available. The Government reserves the right to cancel this solicitation, either before or after the closing date. In the event the Government cancels this solicitation, the Government has no obligation to reimburse an offeror for any