TECHNOLOGY/BUSINESS OPPORTUNITY High Density Electrochemical Additive Manufacturing with CMOS Microanode Array

Opportunity: Lawrence Livermore National Laboratory (LLNL), operated by the Lawrence Livermore National Security (LLNS), LLC under contract no. DE-AC52-07NA27344 (Contract 44) with the U.S. Department of Energy (DOE), is offering the opportunity to enter into a collaboration to further develop and commercialize its high density electrochemical additive manufacturing process.Background: Maskless localized electrochemical deposition (LECD) is a novel additive manufacturing process that forms a three-dimensional structure layer-by-layer at the atomic scale. The process is simple, convenient, and low-cost to operate. Neither strict vacuum nor an inert gas environment is required. The challenge for the existing LECD method is that the process is slow and lacks precision. LLNL researchers have been able to develop a novel way to increase speed and accuracy.Description: LLNL’s approach is to design and fabricate a massively-parallel microanode printhead using a custom complementary

metal-oxide semiconductor integrated circuit (CMOS IC) chip with independent electronics for each pixel. This microanode in close proximity to the cathode surface will electroplate dissolved ions into a small voxel. The probe then moves and continues to deposit material creating wires, rods, or other shapes. The resulting setup is a high density localized electrochemical deposition (HD-LECD). The application specific integrated circuit (ASIC) chip inside the printhead is a microanode array with hundreds of parallel electrodes and independent current generator circuits, which would increase electrodeposition throughput and improve accuracy.Advantages/Benefits: Value Proposition: Faster and more precise additive manufacturing of miniature batteries, neural prosthetics, and microelectronic interconnects.Massive parallelization -> Higher throughputIndependent electronics per pixel -> Improved accuracyPotential Applications: Electrochemical devices such as batteries, electrolyzers, fuel cells, CO2 electroreduction reactors, etc.Localized Electrochemical Deposition (LECD) additive manufacturing technology for printing metals, alloys and conductive polymersHD-LECD directly on top of other ASICs to create on-chip antennas, on-chip batteries, and on-chip MEMS sensorsDevelopment Status: Current stage of technology development: TRL 2 (Technology concept and/or application formulated)LLNL has filed for patent protection on this invention.U.S. Patent Application No. 2023/0095982 SYSTEM AND METHOD FOR DIRECT ELECTROLESS PLATING OF 3D-PRINTABLE GLASS FOR SELECTIVE SURFACE PATTERNING published 3/30/2023.LLNL is seeking industry partners with a demonstrated ability to bring such inventions to the market. Moving critical technology beyond the Laboratory to the commercial world helps our licensees gain a competitive edge in the marketplace. All licensing activities are conducted under policies relating to the strict nondisclosure of company proprietary information. Please visit the IPO website at https://ipo.llnl.gov/resources for more information on working with LLNL and the industrial partnering and technology transfer process.Note: THIS IS NOT A PROCUREMENT. Companies interested in commercializing LLNL's high density electrochemical additive manufacturing process should provide an electronic OR written statement of interest, which includes the following:Company Name and address.The name, address, and telephone number of a point of contact.A description of corporate expertise and/or facilities relevant to commercializing this technology.Please provide a complete electronic OR written statement to ensure consideration of your interest in LLNL's high density electrochemical additive manufacturing process.The subject heading in an email response should include the Notice ID and/or the title of LLNL’s Technology/Business Opportunity and directed to the Primary and Secondary Point of Contacts listed below.Written responses should be directed to:Lawrence Livermore National LaboratoryInnovation and Partnerships OfficeP.O. Box 808, L-779Livermore, CA 94551-0808Attention: IL-13825