Advanced Packaging - Nine Various Semiconductor Tools and Equipment - Center for Neovation Expansion (USDOC EDA Award 04-79-07799)

The selected solicitation details are below. Some agencies require their vendors to register before they are allowed to download documents. Click here to register or select the Register Link above. You can click on the Contact's name below to request the solicitation by email. Please include in your email your name, company name, email and phone number. Agency Osceola County Board of County Commissioners Status Active Fiscal Year 2023 Primary Contact Ted Phillips Secondary Contact Tertiary Contact Title Advanced Packaging - Nine Various Semiconductor Tools and Equipment - Center for Neovation Expansion (USDOC EDA Award 04-79-07799) Number RFP-23-13912-TP Type Request for Proposal Online Quote/Bid No Department Public Works Piggyback Solicitation No Insurance Required Yes Bid Bond Required No Bid Bond Amount Performance Bond Required No Performance Bond Amount Scope of Services 1. Osceola County, on behalf of BRIDG, is seeking metrology equipment for the use in Advanced Packaging. Each

tool shall meet or exceed the following criteria found within the solicitation. BRIDG is a Florida not-for-profit corporation focused on NeoCity expansion and the evolution of Digital and Radio Frequency (RF) silicon interposer technology coupled with Advanced Packaging solutions as a public-private partnership. BRIDG offers Research and Development expertise and a 200mm microelectronics fabrication facility, geared toward system miniaturization, device integration, hardware security, and product manufacturing key to aerospace, defense, automotive, telecommunications, medical and the Internet of Things (IoT)/Artificial Intelligence (AI) revolution. 2. Osceola County, on behalf of BRIDG, invites leading global companies with system integration and advanced packaging manufacturing endeavors to participate in an industry-friendly ecosystem for Digital and RF interposer technology, photonics and optics, and other advanced device packaging and manufacturing opportunities. By leveraging unique emerging technology capabilities, processes, and background Intellectual Property (IP), BRIDG will develop advanced lab/fab and universal technology platforms with the economy of scale needed for cost-effective manufacturing. 3. It is the intent and purpose of this solicitation to promote competition. It shall be the proposer’s responsibility to advise the Procurement Services Representative at the address noted above, if any language, requirements, etc., or any combination thereof, inadvertently restricts or limits competition or if the requirements stated in this document limits it to a single source. Such notification must be submitted in writing and must be received by the Procurement Services Representative no later than ten (10) calendar days prior to the proposal closing date. 4. Osceola County, on behalf of BRIDG, seeks to purchase the following semiconductor tools and/or equipment: a. Lot 1 - Die Attach: Automated Micro Assembly Cell –for specifications, please refer to Section II, item F within the solicitation. b. Lot 2 - Wafer or Die Ball Attach: Automatic Solder Ball Bumper – for specifications, please refer to Section II, item G within the solicitation. c. Lot 3 - Low Particle Oven: Reflow - for specifications, please refer to Section II, item H within the solicitation. d. Lot 4 - Granular Compression Molding System – for specifications, please refer to Section II, item I within the solicitation. e. Lot 5 - Low Gross and Fine Leak Detector for Hermetic Package – for specifications, please refer to Section II, item J within the solicitation. f. Lot 6 - Lid Attach System - for specifications, please refer to Section II, item K within the solicitation. g. Lot 7 - Laser Marking System – for specifications, please refer to Section II, item L within the solicitation. h. Lot 8 - Wire Bonding System – for specifications, please refer to Section II, item M within the solicitation. i. Lot 9 - Compact Environmental Chamber – for specifications, please refer to Section II, item N within the solicitation. 5. It is understood that not all suppliers can support every tool in this bid. Suppliers are asked to respond to the equipment types they can supply and support. Bidders are asked to provide product specifications for the tool(s) they are bidding on. Broadcast Date 6/18/2023 12:00 PM Question End Date 7/7/2023 12:00 PM Due Date 8/8/2023 2:00 PM Anticipated Award Date 9/18/2023 *PDF files require Adobe Reader to view. Preconference(s) Total: 0 DateTimeMandatoryLocation Documents Total: 5 TypeNameDescriptionFile Type Request for ProposalsSolicitation - RFP-23-13912-TP.pdfSolicitation - RFP-23-13912.-TPPDF AddendumAddendum 1 -RFP-23-13912-TP.pdfAddendum #1 - RFP-23-13912-TPPDF AddendumAddendum 2 -RFP-23-13912-TP.pdfAddendum 2 - RFP-23-13912-TPPDF AddendumAddendum 3 -RFP-23-13912-TP.pdfAddendum 3 - RFP-23-13912-TPPDF AddendumAddendum 4 -RFP-23-13912-TP.pdfAddendum #4 - RFP-23-13912-TPPDF Commodity Codes Total: 10 CodeDescription[203-91]Tools, Computer, Environmentally Certified Products[207-91]Tools, Computer[208-87]Tools, Programming and Case [445-82]Tool Sets, All Kinds [838-90]Tools and Supplies for Copper and Fiber Optic Wiring Systems[285-62]Meters, Indicating and Recording (Of Power line Fluctuations - Voltage or Amperage - Not Hand Tool Type)[204-16]Chips: Accelerator, Graphics, Math Co-Processor, Memory (RAM and ROM), Network, SIMMS, etc. [206-17]Chips: Accelerator, Graphics, Math Co-Processor, Memory (RAM and ROM), Network, etc. [393-10]Chips, All Types[287-42]Microprocessors (CPU Chips, etc.) Publications Total: 2 PublicationDateOrlando Sentinel6/18/2023Osceola News Gazette6/22/2023 Planholders Total: 16 CompanyE-mailFirst Access APIC YAMADA CORPORATIONjeff_nakazawa@yamaha-motor.com7/9/2023 6:32:27 PM Archis Inc.bids@archistech.com 7/11/2023 6:26:45 AM Bruker Nano, Inc.Joseph.Gaborsky@bruker.com7/12/2023 6:01:46 PM Cook and Weil incaweil@cwitechsales.com6/19/2023 11:28:37 AM Cook and Weil, inc.nweil@cwitechsales.com7/8/2023 1:09:35 PM DISCO Hi-Tec Americarandall_c@discousa.com7/3/2023 2:18:41 PM FineTech USAsmm@finetechusa.com7/24/2023 4:30:58 PM HIPP Design & Consulting, Inc.BD@hipp-usa.com7/21/2023 8:30:31 AM KULICKE AND SOFFA INDUSTRIES INCscann@kns.com6/20/2023 11:24:40 AM North America Procurement Council, Inc. PBClyra@napc.me7/4/2023 6:45:14 AM Semiconductor Molding Equipmentk_wada@towajapan.co.jp7/26/2023 11:30:59 PM SUSS MicroTec Inc.Emyr.Edwards@suss.com7/10/2023 12:29:51 PM TOWA USA Corporationtkoh@towa-usa.com7/26/2023 11:24:51 AM Trio-Tech Internationaljeasterson@triotech.com7/24/2023 5:46:02 PM XYZTEC, Inctom.haley@xyztec.com6/19/2023 5:14:01 AM Yield Engineering Systems, Inc.jrobberstad@yieldengineering.com7/11/2023 10:24:26 AM Contract Dates Total: 0 Awarded CompanyTerm TypeContract NumberApproval DateStart DateEnd DateSubstantial Completion DateStatusAmountComment Pre-Award Documents Total: 0 CategoryNameFile Type Contract Documents Total: 0 CompanyAwardee TypeCategoryNameFile Type Bidders Total: 0 CompanyEmailPhoneFax Awardees Total: 0 CompanyEmailPhoneFax Insurance Total: 0 CompanyTypeStart DateEnd Date Bond Total: 0 CompanyTypeStart DateEnd Date