Mask Aligner with Align for Bond

THIS IS NOT A REQUEST FOR PROPOSAL. NO PROPOSALS ARE TO BE SUBMITTED IN RESPONSE TO THIS NOTICE.This notice is issued by the NASA/GSFC to post a draft Statement of Work to solicit responses from interested parties. This document is for information and planning purposes and to allow industry the opportunity to verify reasonableness and feasibility of the requirement, as well as promote competition. The Detector Systems Branch of GSFC has a requirement to acquire a contact mask-aligner system with align-for-bond capabilities, for use in the Detector Development Lab (DDL). The system has two main functions, 1) is to align a mask to a substrate (typically a wafer) and 2) is to expose UV light onto the substrate through the mask. The align and expose feature is used to transfer patterns from metal patterned glass plates to silicon wafers (or other substrates) containing a UV sensitive resist coating. Additionally, an align-for-bond feature allows multiple substrates to be aligned together

and held in place prior to transfer, via fixturing, to a separate system which bonds the two substrates together maintaining the previous alignment. The bonding system is not in scope of this requirement. The system shall include all necessary software and hardware to enable precision alignment, force control and temperature control. The vendor shall provide technical support of the equipment. The current requirement is for a system that can align and expose, as well as align for subsequent bonding.The Detector Systems Branch has a separate bonding system. The requirement presented here is for a system capable of mask-to-substrate alignment (followed by UV light exposure) and shall also be capable of alignment for bonding, directly interfacing with an existing EVG 501 bonder. Any fixtures or substrate-holding required to interface with an EVG bonding system shall be included and work seamlessly with the existing bonding system.Such a system is essential for nearly all device fabrication projects under development and in production in GSFC’s Detector Development Lab. While the DDL has multiple processes to create patterns for devices, contact lithography remains the most used among all projects. The requirement is important to maintaining capability in the DDL.This presolicitation synopsis is not to be construed as a commitment by the Government, nor will the Government pay for the information submitted in response. The Government may not respond to questions/concerns submitted. The Government will use the information to finalize the RFP as necessary.All comments or questions shall be submitted electronically via email to Stephanie Stephens, stephanie.d.stephens@nasa.gov , no later than March 23, 2023, 4:00 pm est. When responding reference Mask Aligner System.NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at : https://www.hq.nasa.gov/office/procurement/regs/Procurement-Ombuds-Comp-Advocate-Listing.pdfIf a solicitation is released, then it and any additional documents will be available on www.Sam.gov. It is the offeror's responsibility to monitor this website for the release of the solicitation and amendments (if any). Potential offerors will be responsible for downloading their own copy of the solicitation and amendments