Wire Bonding

NASA/GSFC has a requirement to purchase a ball bonder with a 45 degree and 90 degree wedge head. The objective of this project is to procure a wire bonder that is capable of fully automatic wire bonding devices at a high rate. The system shall be capable of ball bonding and wedge-wedge bonding, both 45 degree and 90 degree. The system must be convertible by the end user between different types of bonding.NASA/GSFC intends to award a sole source fixed price contract to F&K Delvotec, Inc. F&K Delvotec. Inc. located at 27182 Burbank, Foothill Ranch, CA 92610. F&K Delvotec is the only vendor that offers one system that can perform both ball bonding and wedge bonding. During market research a few vendors offered either ball bonding or wedge bonding capabilities, but not both capabilities combined. While potentially possible to purchase multiple tools to achieve this capability, the cost of the tools and physical space requirement for this approach would create a major burden to the government.The Government intends to acquire a commercial item using FAR Part 12.Interested organizations may submit their capabilities and qualifications to perform the effort by email to Alpana.K.Jenne@nasa.gov no later than 3:00 p.m. Eastern time on September 13th. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis.A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government.Oral communications ARE NOT acceptable in response to this notice.All responsible sources may submit an offer which shall be considered by the